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LDS+ NFC Antenna for Mobile Application

LDS + FPC Antenna

规格:

  • Common resin materials as following:
  • PC (Polycarbonate)
  • Electroplating thickness as following:
  • Cu = 8+/-2 um
  • Ni = 3+/-1 um
  • (Au > 0.05 um options)
  • NFC Base Material:
  • PI Resin
  • Electroplating thickness:
  • Cu plating ≥ 0.5 OZ
  • Ni plating ≥ 1um
  • Au plating ≥ 0.03um
  • Adhesive:
  • 3M/TESA/ Customized
  • Ferrite type:
  • Customized
  • Protective:
  • S/M, Coverlay
  • Black / Customized


产品特性:

  • High degree of design flexibility.
  • Ability to make products smaller by creating antenna structures on the enclosure.
  • Facilitates quick change of antenna layouts easily without expensive tooling changes.
  • resins available including popular PC, PC/ABS, ABS materials.
  • Offers cost-savings particularly for higher volume applications.

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